GN electronics supplies high-quality ceramic substrates, both in standard design and according to your specification. All products undergo a full range of tests by GOST and company product specification, as well as MIL and Telcordia standards, and are confirmed by quality certificates. The offered products are widely used in microelectronics, power electronics, electronic industry. For several materials, the company has developed and approved specifications that reflect the technical characteristics and requirements for products, production control methods, and acceptance rules.
The company works with materials:
- Vacuum-tight oxide ceramics AL2O3 94.0% (VK-94DN), 96.0% (VK- 96DN), 99.6% (VK-100DN) (Analogues: VK94, VK96, VK100, leucosapphire);
- Aluminum nitride ALN-170, 200, 230;
- Beryllium oxide BeO 97% (OBK-97), 99% (OBK-100);
- Silicon carbide (reaction bonded, reaction sintered) (see section piezoceramics and crystals);
- Silicon nitride Si3N4;
- Ceramics based on zirconium oxide ZrO2;
- As well as a group of ceramic materials with high dielectric constant (microwave ceramics).
Main specifications
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Properties |
Main materials |
High strength |
High thermal conductivity |
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AL203 96,0% |
AL2O3 99,6% |
Si3N4 |
ZrO2 |
AIN-170 |
AIN-200 |
AIN-230 |
BeO 99% |
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Color |
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White |
White |
Gray |
White |
Gray |
Gray |
Gray |
Gray |
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Bulk density |
г/см3 |
3,76 |
3,75 |
3,21 |
3,95 |
3,30 |
3,28 |
3,25 |
2,85 |
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Surface roughness Ra (grinding) |
мкм |
0,2-0,7 |
0,3-0,5 |
- |
0,2 |
0,3-0,5 |
0,3-0,5 |
0,3-0,5 |
0,5 |
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Surface roughness Ra (polished) |
мкм |
- |
<0,05 |
- |
<0,05 |
<0,05 |
<0,05 |
<0,05 |
<0,01 |
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Flexural strength |
МПа |
≥ 350 |
≥ 500 |
900 |
1200 |
≥ 380 |
≥ 380 |
≥ 350 |
≥ 180 |
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Elastic modules |
ГПа |
330 |
330 |
315 |
200 ~ 250 |
320 |
320 |
320 |
345 |
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Vickers hardness |
ГПа |
14 |
16 |
— |
11 |
11 |
11 |
11 |
— |
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Coefficient of thermal expansion |
10-6 /°C |
6,5~8,0 |
6,2~8,2 |
3,1 |
10,3 |
2,0~3,5 |
— |
4,6~5,2 |
7,0~8,5 |
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Thermal conductivity (25 С) |
Вт/м∙K |
≥ 24 |
≥ 30 |
19 |
— |
≥ 170 |
≥ 200 |
≥ 230 |
≥ 230 |
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Specific heat |
Дж/кг∙К |
750 |
750 |
3,1 |
400 |
720 |
720 |
720 |
— |
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Dielectric constant (1МГц) |
— |
9 ~ 10 |
10 |
— |
— |
8 ~ 10 |
8 ~ 10 |
8,5 |
6,5 ~ 7,3 |
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Dielectric loss (tan delta) (1МГц) |
∙10-4 |
2 |
2 |
— |
— |
2 |
2 |
3 |
≤ 4 |
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Dielectric strength (DC) |
кВ/мм |
≥ 17 |
≥ 15 |
— |
— |
≥ 17 |
≥ 17 |
≥ 15 |
≥ 18 |
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Volume resistivity (25 C) |
Ом∙см |
≥ 1014 |
≥ 1014 |
≥ 1014 |
≥ 1014 |
≥ 1013 |
≥ 1013 |
≥ 1013 |
≥ 1014 |
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СОВМЕСТИМОСТЬ С ТЕХНОЛОГИЯМИ МЕТАЛЛИЗАЦИИ |
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DBC |
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- |
- |
- |
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- |
- |
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Thin-films technology |
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Thick-films technology |
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ТЕХНОЛОГИЧЕСКИЕ ХАРАКТЕРИСТИКИ |
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Distance between scribing lines |
мм |
1±0,05 |
1±0,05 |
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1±0,05 |
1±0,05 |
1±0,05 |
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Minimum hole diameter |
мм |
0,1±0,05 |
0,1±0,05 |
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0,1±0,05 |
0,1±0,05 |
0,2±0,05 |
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Thickness |
мм |
0,2 ~ 2,0 |
≤ 0,635 |
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0,385 ~ 1,500 |
0,385 ~ 1,500 |
0,25 ~ 1,00 |
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Thickness tolerance, min |
мм |
± 0,03 |
± 0,04 |
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± 0,03 |
± 0,03 |
±10%, не менее ±0,04 мм |
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Dimensions, max |
мм |
139,7 x 190,5 |
120 x 120 |
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127 x 127 |
127 x 127 |
177,8 x 127 |
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Dimensions tolerance, min |
мм |
(+0,15 / -0,05) |
±0,1; ±2 |
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(+0,15 / -0,05) |
(+0,15 / -0,05) |
±1%, не менее ±0,1 мм |
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