Aluminium oxide (Al2O3)

Aluminium oxide (Al2O3)

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Volumetric ceramic parts made of aluminum oxide Al2O3 are the basis for the creation of ceramic capacitors, resistors, insulators, covers and various semiconductor elements and electrical products.

The raw material for the production of vacuum-tight ceramics Al2O3 is corundum, so ceramics are often called not only "aluminum oxide", but also corundum ceramics. Vacuum-tight corundum ceramics are resistant to various acids and other aggressive media, and are an excellent durable insulator. Substrates made of Al2O3 do not lose their performance in case of sudden temperature changes.

An important role is played by the percentage of aluminum oxide in the total volume and its crystal lattice. They determine its future performance characteristics, such as thermal conductivity, hardness, bending strength, coefficient of specific expansion and others.




Specifications

Properties

Conditions

Units of measurement

Materials

Al2O3 75%

Al2O3 95%

Al2O3 99%

Al2O3 99,5%

Colour

 

 

brown

white

white

white

Bulk density

 

г/см3

≥ 3,20

≥3,63

≥3,85

≥3,90

Water absorption

%

0

0

0

Flexural strength

 

МПа

250 ~ 280

≥280

≥338

≥379

Compressive strength

 

МПа

≥2000

≥2240

≥2240

Modulus of elasticity

 

ГПа

160

≥280

≥250

410

Poisson 's Ratio

 

 

0,23

0,23

0,24

Coefficient of thermal expansion

20-800 °C

10-6 /°C

5 ~ 5,5

5,0~8,0

6,2~8,0

6,5~8,0

Thermal conductivity

25 °C

Вт/м∙K

17

18 ~ 24

27 ~ 32

27 ~ 32 

Heat shock resistance

ΔT

°C

190

≥220

≥200

≥200

Maximum operating temperature

 

°C

1300

1500

1580

1600

Dielectric constant

1 МГц

8,3 ~ 9,0

9,5

9,5 ~ 10,2

9,5 ~ 9,8

Dielectric losses

1 МГц

∙10-4

 

1 ~ 5

1 ~ 70

5

Dielectric strength

DC

кВ/мм

25 ~ 30

14,5

13 ~ 18

15

Volumetric resistance

25 °C

Ом∙см

≥ 1012

≥ 1014

≥ 1014

≥ 1014

300 °C

Ом∙см

1012 - 1013

≥ 8 * 1011

≥ 1012

500 °C

Ом∙см

≥ 109

≥ 5 *1010

≥ 2*109

Thick film

нет

Mo/Mn + Ni

Mo/Mn + Ni

Mo/Mn + Ni



Application area

  • power electronics, converter equipment (radio communication devices, broadcasting equipment, medical electrical equipment, etc.);
  • insulation gaskets for heat removal from electronic components to the cooling radiator;
  • protectors for elements of piezoelectric converters;
  • auto electronics (multiplicated boards for resistors, rheostats, fuel level sensors, pressure sensors, LED headlights, electric power steering, ABS, ASR systems, etc.)
  • precision substrates for microwave GIS and microassemblies with a high density of holes and recesses for crystals;
  • carriers of sensor circuits of toxic substances, ionizing radiation, magnetic field, etc.;
  • semiconductor industry (thermoelectric modules and heat removal devices, analytical equipment, wireless power sources, energy-efficient waste heat disposal systems, radio electronic, laser and optical systems, LEDs (energy-saving technologies), IGBT modules

See also