Plasma equipment GN tech

Often, products are stored before further technological processes, because of which their surface can be subjected to organic contamination by humans, undergo passivation, lose activity, absorb various gases from the atmosphere, etc.

To solve these problems, vacuum plasma systems manufactured by GN electronics are perfect, which are designed for such processes as cleaning, etching, surface activation for microelectronics and biology products. The equipment can be designed or adapted to the needs of the customer with the setting of the necessary processing modes.

More information about the model range of vacuum equipment can be found on the new official website of GN tech

The surface is cleaned of contaminants mechanically, using an inert gas such as argon, or chemical-mechanically, using an oxygen.

Cleaning can be used for ceramic substrates before metallization processes,thermoelectric modules before installation, etc. 

Surface etching on equipment of this type is carried out exceptionally mechanically, by bombarding the surfaces with argon ions in a low-frequency plasma. It can be used to remove oxide layers from metallization, remove photoresist, microstructuring semiconductors.

Surface activation is an increase in the chemical activity of the surfacedue to its finishing in high-frequency plasma. Surface activation is a great way to improve the adhesion properties of future coatings to the treated surface. It can be used to activate transported components before soldering processes, metallization of printed circuit boards before soldering, or surface activation before coating processes.

Main specifications

The main characteristics of vacuum plasma systems are:

  • frequency of the plasma generator (selected for the required processing);
  • generator power;
  • volume of the working chamber and its material;
  • working gases (types and quantity);
  • dimensions of the systems.

Other characteristics are specified in the description of individual types of equipment.